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Materials Handbook for Hybrid Microelectronics

Materials Handbook for Hybrid Microelectronics Author : Joseph Alison King
Release : 1988
Publisher : Artech House on Demand
ISBN :
File Size : 78.87 MB
Format : PDF, ePub, Docs
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The result of a joint effort between representatives of private industry and academia, the publication is divided into sections on elements, alloys, insulators and compound semi-conductors. An index and bibliography are lacking. Numerous simple graphs and charts are provided, in fact most of the boo

Electronic Materials Handbook

Electronic Materials Handbook Author :
Release : 1989-11-01
Publisher : ASM International
ISBN : 9780871702852
File Size : 44.81 MB
Format : PDF, ePub
Download : 929
Read : 885

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Hybrid Microcircuit Technology Handbook, 2nd Edition

Hybrid Microcircuit Technology Handbook, 2nd Edition Author : James J. Licari
Release : 1998-12-31
Publisher : Elsevier
ISBN : 081551798X
File Size : 39.59 MB
Format : PDF, Kindle
Download : 613
Read : 1227

The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

Handbook of Thick- and Thin-Film Hybrid Microelectronics

Handbook of Thick- and Thin-Film Hybrid Microelectronics Author : Tapan K. Gupta
Release : 2003-04-17
Publisher : Wiley-Interscience
ISBN :
File Size : 32.67 MB
Format : PDF, Kindle
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"This handbook is meant to be an introduction to the design, layout , and fabrication of hybrid microelectronic circuits for electrical engineering students as well as a reference book for practitioners in this discipline. ... The text has grown out of notes prepared for a one-semester graduate level course in the Electrical Engineering Department of Tufts university." -- preface.

Springer Handbook of Electronic and Photonic Materials

Springer Handbook of Electronic and Photonic Materials Author : Safa Kasap
Release : 2017-10-04
Publisher : Springer
ISBN : 331948933X
File Size : 41.83 MB
Format : PDF, ePub, Mobi
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The second, updated edition of this essential reference book provides a wealth of detail on a wide range of electronic and photonic materials, starting from fundamentals and building up to advanced topics and applications. Its extensive coverage, with clear illustrations and applications, carefully selected chapter sequencing and logical flow, makes it very different from other electronic materials handbooks. It has been written by professionals in the field and instructors who teach the subject at a university or in corporate laboratories. The Springer Handbook of Electronic and Photonic Materials, second edition, includes practical applications used as examples, details of experimental techniques, useful tables that summarize equations, and, most importantly, properties of various materials, as well as an extensive glossary. Along with significant updates to the content and the references, the second edition includes a number of new chapters such as those covering novel materials and selected applications. This handbook is a valuable resource for graduate students, researchers and practicing professionals working in the area of electronic, optoelectronic and photonic materials.

Handbook of Porphyrin Science (Volumes 16 – 20): With Applications to Chemistry, Physics, Materials Science, Engineering, Biology and Medicine

Handbook of Porphyrin Science (Volumes 16 – 20): With Applications to Chemistry, Physics, Materials Science, Engineering, Biology and Medicine Author : Karl M Kadish
Release : 2012-06-08
Publisher : World Scientific
ISBN : 9814462241
File Size : 46.75 MB
Format : PDF, Mobi
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This is the fourth set of Handbook of Porphyrin Science.Porphyrins, phthalocyanines and their numerous analogues and derivatives are materials of tremendous importance in chemistry, materials science, physics, biology and medicine. They are the red color in blood (heme) and the green in leaves (chlorophyll); they are also excellent ligands that can coordinate with almost every metal in the Periodic Table. Grounded in natural systems, porphyrins are incredibly versatile and can be modified in many ways; each new modification yields derivatives, demonstrating new chemistry, physics and biology, with a vast array of medicinal and technical applications.As porphyrins are currently employed as platforms for study of theoretical principles and applications in a wide variety of fields, the Handbook of Porphyrin Science represents a timely ongoing series dealing in detail with the synthesis, chemistry, physicochemical and medical properties and applications of polypyrrole macrocycles. Professors Karl Kadish, Kevin Smith and Roger Guilard are internationally recognized experts in the research field of porphyrins, each having his own separate area of expertise in the field. Between them, they have published over 1500 peer-reviewed papers and edited more than three dozen books on diverse topics of porphyrins and phthalocyanines. In assembling the new volumes of this unique handbook, they have selected and attracted the very best scientists in each sub-discipline as contributing authors.This handbook will prove to be a modern authoritative treatise on the subject as it is a collection of up-to-date works by world-renowned experts in the field. Complete with hundreds of figures, tables and structural formulas, and thousands of literature citations, all researchers and graduate students in this field will find the Handbook of Porphyrin Science an essential, major reference source for many years to come.

Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties Author : Michael Pecht
Release : 1998-12-18
Publisher : CRC Press
ISBN : 9780849396250
File Size : 79.20 MB
Format : PDF, Kindle
Download : 705
Read : 277

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Hybrid Microelectronics Handbook

Hybrid Microelectronics Handbook Author : Jerry E. Sergent
Release : 1995
Publisher : McGraw-Hill Companies
ISBN :
File Size : 58.26 MB
Format : PDF, Mobi
Download : 317
Read : 996

Featuring new contributions from experts in the field, the second edition of the Handbook provides electronics design, process, and packaging engineers with the data they need to design, test, and manufacture today's most-wanted hybrid microcircuits.

Handbook of Porphyrin Science (Volumes 6 – 10): With Applications to Chemistry, Physics, Materials Science, Engineering, Biology and Medicine

Handbook of Porphyrin Science (Volumes 6 – 10): With Applications to Chemistry, Physics, Materials Science, Engineering, Biology and Medicine Author : Karl M Kadish
Release : 2010-06-29
Publisher : World Scientific
ISBN : 9814464910
File Size : 44.45 MB
Format : PDF, ePub
Download : 692
Read : 538

This is the second set of Handbook of Porphyrin Science.Porphyrins, phthalocyanines and their numerous analogues and derivatives are materials of tremendous importance in chemistry, materials science, physics, biology and medicine. They are the red color in blood (heme) and the green in leaves (chlorophyll); they are also excellent ligands that can coordinate with almost every metal in the Periodic Table. Grounded in natural systems, porphyrins are incredibly versatile and can be modified in many ways; each new modification yields derivatives, demonstrating new chemistry, physics and biology, with a vast array of medicinal and technical applications.As porphyrins are currently employed as platforms for study of theoretical principles and applications in a wide variety of fields, the Handbook of Porphyrin Science represents a timely ongoing series dealing in detail with the synthesis, chemistry, physicochemical and medical properties and applications of polypyrrole macrocycles. Professors Karl Kadish, Kevin Smith and Roger Guilard are internationally recognized experts in the research field of porphyrins, each having his own separate area of expertise in the field. Between them, they have published over 1500 peer-reviewed papers and edited more than three dozen books on diverse topics of porphyrins and phthalocyanines. In assembling the new volumes of this unique Handbook, they have selected and attracted the very best scientists in each sub-discipline as contributing authors.This Handbook will prove to be a modern authoritative treatise on the subject as it is a collection of up-to-date works by world-renowned experts in the field. Complete with hundreds of figures, tables and structural formulas, and thousands of literature citations, all researchers and graduate students in this field will find the Handbook of Porphyrin Science an essential, major reference source for many years to come.

Hybrid Microcircuit Technology Handbook, 2nd Edition

Hybrid Microcircuit Technology Handbook, 2nd Edition Author : James J. Licari
Release : 2008-12-11
Publisher : William Andrew
ISBN : 9780080946597
File Size : 73.2 MB
Format : PDF
Download : 404
Read : 432

The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

The Electronics Handbook

The Electronics Handbook Author : Jerry C. Whitaker
Release : 1996-12-23
Publisher : CRC Press
ISBN : 9780849383458
File Size : 80.34 MB
Format : PDF, Mobi
Download : 806
Read : 930

The superb organization of The Electronics Handbook means that it is not only a comprehensive and fascinating reference, but also a pleasure to use. Some of these organizational features include:

The Electronic Packaging Handbook

The Electronic Packaging Handbook Author : Glenn R. Blackwell
Release : 2017-12-19
Publisher : CRC Press
ISBN : 9781420049848
File Size : 46.19 MB
Format : PDF, ePub, Docs
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The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Handbook of Electronic Package Design

Handbook of Electronic Package Design Author : Michael Pecht
Release : 1991-08-16
Publisher : CRC Press
ISBN : 9780824779214
File Size : 73.80 MB
Format : PDF, ePub, Docs
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Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Electronic Materials and Processes Handbook

Electronic Materials and Processes Handbook Author : Charles A. Harper
Release : 2003-08-22
Publisher : McGraw Hill Professional
ISBN : 0071433465
File Size : 39.39 MB
Format : PDF, ePub, Mobi
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Micro-miniaturization in electronics--a necessity for personal communications devices like cell phones and PDAs--has radically altered the materials these electronics are made from. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and microminiature sizes, and will be an invaluable tool to anyone working in electronic packaging, fabrication, or assembly design. * ALL NEW--A complete rewrite of the previous edition * Details and characterizes every major material type, allowing engineers to make accurate, cost-effective design choices * Full materials breakdown for high density packaging techniques * Materials for communications wiring and cabling

Thermal Management Handbook: For Electronic Assemblies

Thermal Management Handbook: For Electronic Assemblies Author : Jerry E. Sergent
Release : 1998
Publisher : McGraw Hill Professional
ISBN : 9780070266995
File Size : 40.27 MB
Format : PDF, Mobi
Download : 535
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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

Handbook of Printed Electronics

Handbook of Printed Electronics Author : Jasmin Aghassi
Release : 2020-12-01
Publisher : Springer
ISBN : 9783030413910
File Size : 29.47 MB
Format : PDF, ePub
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This handbook is a world-class reference volume on the processes, industry requirements, and emerging application areas of printed electronics. Containing contributions from experts in academia and industry, it provides a balanced presentation of the field and is appropriate for a wide audience, from students, to researchers and industrial product designers. It is organized into 3 sections; the first focuses on materials used in printed electronics devices. Chapters cover the requirements for components such as active materials, interconnects, passives, substrates and encapsulation, current state-of-the-art, and possible future developments. Fundamental performance requirements are also critically assessed and compared with properties of materials currently available.The second section covers all aspects of available and foreseeable process technology and critically reviews the suitability of methods and materials for production processes. Topics that are addressed include fabrication, dispersion and inks, film formation and drying processes, sheet-based and roll-to-roll printing techniques, encapsulation processes, microcontact printing, and nano-imprint lithography.The last section presents an overview of device-level printed electronics and technologies that have reached a level of maturation that allows for design and fabrication of integrated modules and systems. The current research and industrial developments are reviewed for printed lighting and displays, printed photovoltaics, organic/inorganic/hybrid components for printed electronics, printed transistors and logic structures, and printed energy storage devices.

Modeling and Simulation for Microelectronic Packaging Assembly

Modeling and Simulation for Microelectronic Packaging Assembly Author : Sheng Liu
Release : 2011-08-24
Publisher : John Wiley & Sons
ISBN : 0470828412
File Size : 25.37 MB
Format : PDF, Kindle
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Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Handbook of Organic Materials for Optical and (Opto)Electronic Devices

Handbook of Organic Materials for Optical and (Opto)Electronic Devices Author : Oksana Ostroverkhova
Release : 2013-08-31
Publisher : Elsevier
ISBN : 0857098764
File Size : 34.64 MB
Format : PDF, ePub
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Small molecules and conjugated polymers, the two main types of organic materials used for optoelectronic and photonic devices, can be used in a number of applications including organic light-emitting diodes, photovoltaic devices, photorefractive devices and waveguides. Organic materials are attractive due to their low cost, the possibility of their deposition from solution onto large-area substrates, and the ability to tailor their properties. The Handbook of organic materials for optical and (opto)electronic devices provides an overview of the properties of organic optoelectronic and nonlinear optical materials, and explains how these materials can be used across a range of applications. Parts one and two explore the materials used for organic optoelectronics and nonlinear optics, their properties, and methods of their characterization illustrated by physical studies. Part three moves on to discuss the applications of optoelectronic and nonlinear optical organic materials in devices and includes chapters on organic solar cells, electronic memory devices, and electronic chemical sensors, electro-optic devices. The Handbook of organic materials for optical and (opto)electronic devices is a technical resource for physicists, chemists, electrical engineers and materials scientists involved in research and development of organic semiconductor and nonlinear optical materials and devices. Comprehensively examines the properties of organic optoelectronic and nonlinear optical materials Discusses their applications in different devices including solar cells, LEDs and electronic memory devices An essential technical resource for physicists, chemists, electrical engineers and materials scientists

Handbook of Nanoscale Optics and Electronics

Handbook of Nanoscale Optics and Electronics Author :
Release : 2010-05-25
Publisher : Academic Press
ISBN : 9780123751799
File Size : 63.18 MB
Format : PDF, ePub, Mobi
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With the increasing demand for smaller, faster, and more highly integrated optical and electronic devices, as well as extremely sensitive detectors for biomedical and environmental applications, a field called nano-optics or nano-photonics/electronics is emerging – studying the many promising optical properties of nanostructures. Like nanotechnology itself, it is a rapidly evolving and changing field – but because of strong research activity in optical communication and related devices, combined with the intensive work on nanotechnology, nano-optics is shaping up fast to be a field with a promising future. This book serves as a one-stop review of modern nano-optical/photonic and nano-electronic techniques, applications, and developments. Provides overview of the field of Nano-optics/photonics and electronics, detailing practical examples of photonic technology in a wide range of applications Discusses photonic systems and devices with mathematical rigor precise enough for design purposes A one-stop review of modern nano-optical/photonic and nano-electronic techniques, applications, and developments.